Tag: chemical vapor deposition

Pros & Cons of 4 Film Manufacturing Methods

The properties of the thin film are determined by the manufacturing method, and different methods have their own advantages and disadvantages. Commonly used preparation processes include magnetron sputtering, chemical vapor deposition, vacuum evaporation, pulsed laser deposition, etc. Among them, magnetron sputtering deposition technology has been widely researched and applied due to its high film formation rate and good uniformity.

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Magnetron Sputtering

The basic principle of the method is that under the action of electric and magnetic fields, the accelerated high-energy particles (A, +) bombard the surface of the target, and after the energy is exchanged, the atoms on the surface of the target escape from the original lattice, and finally, the sputtering particles are deposited on the surface of the substrate and react with oxygen atoms to form an oxide film. The magnetron sputtering process is characterized by excellent optical and electrical properties of the film deposited at low temperatures. In addition, it has the advantages of a high deposition rate, low substrate temperature, good film adhesion, easy to control, and large-area film formation. Therefore, it has become the most researched and widely used film-forming technology in industrial production today as well as a research hotspot in ITO film preparation technology.

Chemical Vapor Deposition

The chemical vapor deposition method is a process in which a gaseous reactant (including a gaseous reactant that becomes a vaporized condensed matter after evaporation) is chemically reacted on the surface of the substrate to deposit a film. This chemical reaction occurring on the surface of the substrate is usually the thermal decomposition and in-situ oxidation of the source material. The reaction system selected by the CVD method must satisfy:

(1) At the deposition temperature, the reactant must have a sufficiently high vapor pressure;
(2) The chemical reaction product must be in a gaseous state except for the solid matter deposited on the substrate;
(3) The vapor pressure of the deposit should be low enough to ensure good adsorption on a substrate having a certain temperature.

Vacuum Evaporation

The vacuum evaporation method is a method in which a raw material of a to-be-formed film in an evaporation vessel is vaporized from a surface to form a vapor stream, and is incident on a surface of the substrate to react with a gas to form a film in a vacuum chamber. A high-quality ITO film can be prepared by the electron beam evaporation deposition method, in which the evaporation substance is In2O3 doped with SnO2, and the mass percentage of SnO2 is 10%. Under suitable process conditions, the deposited film has a minimum resistivity of 4×10-4 Ω•cm and an average transmittance in the visible range of more than 90%.

Pulsed Laser Deposition

The pulsed laser deposition (PLD) process is a very competitive new vacuum physical deposition process developed in recent years. Compared with other processes, it has the advantages of precise control of stoichiometry, synthesis, and deposition, and no requirement for the shape and surface quality of the target, so the surface of the solid material can be processed without affecting the material body.

Stanford Advanced Materials(SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

Evaporation Coating Experiment: Principle, Purpose & Results

Introduction

In recent years, the rapid economic development and the continuous improvement of people’s living standards have led to the continuous emergence of high-tech thin-film products, especially in the field of electronic materials and components. Vacuum coating technology has also gained significant application in this field.

At present, the common film-forming methods include vapor-phase film-forming method, oxidation method, ion implantation method, diffusion method, electroplating method, coating method, liquid-phase growth method, etc. The vapor generation method can be further subdivided into physical vapor deposition, chemical vapor deposition, and discharge polymerization.

Principle

The experiments listed in this article are related to physical vapor deposition coatings. This method is basically carried out under vacuum, so it is called vacuum coating technology.

Vacuum evaporation, sputter coating, and ion plating are commonly referred to as basic physical vapor deposition thin film preparation techniques. The vacuum evaporation coating method is a method in which the evaporation material of a film to be formed in a vaporization chamber is heated in a vacuum chamber, and atoms or molecules are vaporized from the surface to form a vapor stream, which is incident on the surface of the substrate and condensed to form a solid film.

Evaporation Coating

Purposes

  1. To familiarize yourself with the operating procedures and methods obtained by vacuum;
  2. In order to understand the principle and method of evaporation coating;
  3. To learn how to use evaporation coating technology.

Results

(1) Vacuum conditions during evaporation

When the average free path of the vapor molecules in the vacuum vessel is greater than the distance between the evaporation source and the substrate (called the steaming distance), sufficient vacuum conditions are obtained. For this reason, it is necessary to increase the mean free path of the residual gas to reduce the collision probability of the vapor molecules with the residual gas molecules, and to evacuate the vacuum chamber to a high vacuum.

(2) How to choose evaporation source selection

1 It should have good thermal stability, chemical inactivity; the vapor pressure of the heater itself is sufficient to reach the evaporation temperature.

2 Its melting point should be higher than the evaporation temperature of the evaporated material. The heater should have a large enough heat capacity.

3 The mutual melting of the evaporated material and the evaporation source material must be very low, and it is difficult to form an alloy.

4 The material used for the coil-shaped evaporation source is required to have a good wetting with the evaporation material and a large surface tension.

5 For a case where it is difficult to form a filament, or when the surface tension of the evaporation material and the filament evaporation source is small, a boat-shaped evaporation source can be used.

(3) Main physical processes of thermal evaporation coating

1 Using various forms of thermal energy conversion to vaporize or sublimate the coating material into gaseous particles (atoms, molecules or atomic groups) with certain energy (0.1~0.3eV);

2 Gaseous particles are transported to the substrate by a substantially collision-free linear motion;

3 Particles are deposited on the surface of the substrate and agglomerated into a film.

(4) Factors affecting the quality and thickness of vacuum coating

There are many factors affecting the quality and thickness of the vacuum coating, including the degree of vacuum, the shape of the evaporation source, the position of the substrate, and the temperature of the evaporation source. The solid matter has very low evaporation at normal temperature and normal pressure. The higher the degree of vacuum, the easier it is for the molecules of the evaporation source material to scatter away from the surface of the material. The fewer molecules in the vacuum chamber, the lower the probability that the evaporating molecules will collide with the gas molecules, so that the surface of the substrate can be reached unobstructed straight.

For more information, please visit https://www.samaterials.com/.

PVD vs. CVD: What’s the difference?

PVD vs. CVD: What’s the difference?

In recent years, physical vapor deposition (PVD) and chemical vapor deposition (PVD) have wide applications in various industries to increase the hardness of tools and molds or apply beautiful colors to the products. Thus these two methods are considered as the most attractive surface coating technologies. Then, using the example of cutting tools, let’s make a detailed comparison between these two methods.

Definition

Physical vapor deposition (PVD) uses low-voltage, high-current arc discharge technology under vacuum conditions to evaporate the target and ionize the vaporized material and the gas, and finally make the evaporated material and its reaction deposited on the workpiece.

Continue reading “PVD vs. CVD: What’s the difference?”