Category: semiconductor

Applications of Platinum Sputter Targets

Platinum sputter targets, integral components in diverse industries, contribute significantly to technological advancements and scientific progress. In this comprehensive exploration, we delve into the wide-ranging applications of platinum sputter targets, illuminating their pivotal role in shaping various sectors.

Semiconductor Industry:

The semiconductor industry heavily relies on platinum sputter targets for the fabrication of integrated circuits, which are the backbone of electronic devices. These targets play a crucial role in the physical vapor deposition process, facilitating the deposition of thin platinum films onto semiconductor wafers. The resulting thin films enhance the performance and miniaturization of transistors and capacitors, contributing to the relentless evolution of semiconductor technology.

Platinum’s remarkable conductivity and stability make it an ideal material for creating thin films that ensure efficient electron flow within semiconductor devices. The precision offered by platinum sputter targets is instrumental in achieving the fine details required for intricate electronic components.

Optical Coatings and Thin Films:

The optical properties of platinum, characterized by high reflectivity and low absorption, position it as a key player in optical coatings. Platinum sputter targets are employed in processes like magnetron sputtering to deposit thin films on optical surfaces. These thin films significantly enhance the reflective properties of mirrors and coatings, making them indispensable in optical devices, telescopes, and lenses.

Beyond reflectivity, platinum’s resilience allows these thin films to endure harsh environmental conditions, ensuring the longevity and sustained performance of optical components.

Biomedical Implants and Devices:

Platinum’s biocompatibility and corrosion resistance make it a preferred material in the biomedical field. Platinum sputter targets are instrumental in depositing thin films on medical implants and devices, enhancing biocompatibility, preventing corrosion, and improving overall device performance and safety.

Consider platinum-coated stents used in cardiovascular procedures, where the thin platinum film ensures compatibility with the human body, reducing the risk of adverse reactions and enhancing the device’s effectiveness.

Catalysis and Sensors:

Platinum’s catalytic prowess places it at the forefront of catalysis and sensor technologies. Platinum sputter targets play a crucial role in creating nanostructured platinum films, elevating their catalytic activity. These nanostructured films find applications in fuel cells, where they facilitate the conversion of chemical energy into electrical energy.

In the realm of sensors, platinum-thin films contribute to the development of highly sensitive and selective sensors. Gas sensors benefit from the conductivity and stability of platinum thin films, enabling precise detection of gases in diverse environments for applications in environmental monitoring, industrial safety, and healthcare.

Flexible Electronics:

The flexibility and durability of platinum sputter targets position them prominently in the realm of flexible electronics. As demand surges for flexible displays, wearable devices, and bendable electronics, platinum thin films, deposited using platinum sputter targets, play a pivotal role in creating conductive and reliable components.

Platinum’s ability to maintain electrical properties under mechanical stress renders it an ideal material for flexible electronic applications. Platinum sputter targets ensure the deposition of thin films that guarantee the longevity and robustness of flexible electronic devices.

Further Reading: Everything You Need to Know About Platinum Sputter Targets

Advancements in Research and Development:

Platinum sputter targets serve as cornerstones in research and development activities, providing a platform for exploring new materials and applications. Materials scientists and researchers leverage platinum thin films to experiment with innovative combinations and structures, pushing the boundaries of achievable feats across scientific disciplines.

Emerging technologies like quantum computing and advanced sensors often rely on platinum thin films as integral components. The precision afforded by platinum sputter targets contributes to the development of devices boasting superior electrical conductivity, magnetic properties, and resistance to environmental factors.

Environmental Considerations and Sustainable Practices:

The use of platinum sputter targets also aligns with environmental considerations and sustainable practices. Recycling platinum from used sputtering targets and electronic waste is gaining attention as a sustainable practice. Efficient recycling processes reduce the environmental impact of platinum extraction and address economic challenges associated with the scarcity of this precious metal.

Global Impact and Collaboration:

The applications of platinum sputter targets extend globally, with research and collaboration fostering advancements on an international scale. International collaboration in materials science and engineering accelerates progress in platinum-sputtering technology. Researchers from different countries contribute diverse perspectives and expertise, leading to breakthroughs that benefit a wide range of industries.

Industrial partnerships further amplify the impact of platinum sputter targets. Collaboration between research institutions and industries facilitates the development of customized platinum thin film solutions tailored to specific industrial requirements, promoting the seamless integration of this technology into various sectors.

Conclusion:

In conclusion, the applications of platinum sputter targets are extensive and influential across multiple industries. From their indispensable role in semiconductor manufacturing to their contributions to optical coatings, biomedical devices, catalysis, and flexible electronics, platinum sputter targets continue to be at the forefront of driving innovation.

The unique properties of platinum, coupled with the precision enabled by sputtering processes, make platinum sputter targets irreplaceable in creating high-quality thin films. As technology advances and new applications emerge, the versatility of platinum sputter targets ensures their sustained significance in shaping the future of various technological fields.

The evolving applications, optimization strategies, and global impact of platinum sputter targets underscore their pivotal role in the ever-expanding realm of thin-film technologies. As we look forward, the journey of platinum sputtering continues, promising further breakthroughs and transformative applications that will shape the future of multiple industries.

Exploring the Specific Uses of Zirconium Targets and Thin Films in Different Industries

Zirconium targets and thin films are versatile materials that find a wide range of applications in different industries. With their high melting point, good thermal conductivity, and resistance to corrosion and wear, zirconium-based coatings offer unique properties that make them ideal for use in many different applications.

Semiconductor Industry

Zirconium targets find extensive use in the semiconductor industry for creating thin films with excellent uniformity and purity. In semiconductor manufacturing, zirconium-based coatings are used as diffusion barriers in copper interconnects and as adhesion layers between metal contacts and dielectric layers. These coatings help to enhance the performance, reliability, and durability of semiconductor devices by preventing unwanted chemical reactions, improving electrical conductivity, and enabling precise control of the thickness and composition of each layer.

Energy Industry

Zirconium targets and thin films find significant applications in the energy industry, particularly in solar panel manufacturing. Zirconium-based coatings are applied to solar panels to improve their efficiency by reducing the reflection of sunlight and enhancing light absorption. Zirconium-based coatings also provide corrosion resistance, enabling the solar panels to withstand harsh environments and extend their lifespan. In nuclear power plants, zirconium alloys are used as fuel cladding in the core of reactors due to their excellent corrosion resistance and mechanical strength.

Automotive Industry

Zirconium targets and thin films are used in the automotive industry for coating engine components to improve their wear resistance, hardness, and corrosion protection. Zirconium-based coatings can be applied to automotive parts such as valves, pistons, and bearings to reduce friction and wear, leading to improved fuel efficiency and reduced emissions. Zirconium-based coatings can also provide excellent corrosion protection, enabling automotive parts to withstand harsh environments and extend their service life.

Medical Industry

Zirconium targets and thin films find extensive applications in the medical industry due to their biocompatibility, durability, and corrosion resistance. Zirconium-based coatings are used in orthopedic and dental implants to enhance implant stability, reduce wear and inflammation, and promote bone integration. Zirconium-based coatings can also be applied to medical devices such as surgical instruments and pacemakers to improve their wear resistance and corrosion protection, leading to extended service life and improved patient outcomes.

Aerospace Industry

Zirconium targets and thin films are used in the aerospace industry for coating various components to improve durability and corrosion protection. Zirconium-based coatings are applied to turbine blades, engine parts, and airframe structures to reduce wear, improve fatigue resistance, and enhance corrosion protection. Zirconium-based coatings can also be used as a thermal barrier for components exposed to high temperatures, improving their performance and extending their lifespan.

Conclusion

In summary, zirconium targets and thin films find diverse applications in different industries due to their unique properties and versatility. From semiconductor manufacturing to aerospace engineering, zirconium-based coatings offer numerous benefits such as improved uniformity, purity, durability, wear resistance, and corrosion protection. As research and development continue to advance, zirconium targets and thin films are likely to become an even more important material in many industries.

Read more at sputtertargets.net.

6 Facts About Semiconductor Wafers

1. Semiconductor, as it literally seems to be, is a solid substance whose conductivity is between insulators and most metals, either due to the addition of an impurity or because of temperature effects. In other words, the conductivity of the semiconductor can be controlled by adding impurities as a specific amount of other materials to the semiconductor.

2. Most semiconductor wafers are made of silicon, which is the second-most abundant element in the Earth’s crust (about 28% by mass) after oxygen and the eighth-most common element in the entire universe by mass. In addition to silicon, semiconductors also use other materials, including germanium, gallium arsenide, germanium, indium phosphide, sapphire and quartz.

3. Semiconductor wafers are available in a spread of diameters. The first semiconductor wafer made in the US in 1960 was just 1 inch in diameter. Today, standard semiconductor wafers go up from 12 inches to 18 inches.

4. Water is the key component of manufacturing Silicon wafers. It is a compound that basically is a general solvent for all substances, silicon included. A large production facility uses up to 4.8 million gallons of water every day to supply Silicon wafers for manufacturing needs and supply.

5. The thickness of semiconductor wafers varies greatly. The thickness of the wafer is always determined by the mechanical strength of any material used to make it. Regardless of what the semiconductor is made of, the wafer must be thick enough to support its own weight so that it does not break during processing.

6. Contamination is inevitable during the manufacture and transportation of semiconductors. Appropriate storage conditions must be in place to prevent contamination and/or degradation after shipment. Semiconductor wafers that are not vacuum sealed must be placed in a Nitrogen (N2) cabinet at a flow rate of 2 to 6 SCFH (Standard Cubic Feet per Hour).

Stanford Advanced Materials (SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

Silicon Wafer: 4 Types of Wet Cleaning Method

After the silicon wafer is processed by different processes such as slicing, chamfering, grinding, surface treatment, polishing, and epitaxy, the surface has been seriously stained. The purpose of cleaning the Si wafer is to remove particles, metal ions and organic substances on the surface of the silicon wafer.

Semiconductor-Silicon-Wafers

Wet cleaning uses chemical solvents with strong corrosive and oxidizing properties, such as H2SO4, H2O2, DHF, NH3•H2O, etc. The impurity particles on the surface of the silicon wafer react with the solvent to form soluble substances and gases. In order to improve the cleaning effect, it is possible to use mega-acoustic, heating, vacuum and other technical means, and finally use ultra-pure water to clean the surface of the silicon wafer to obtain a silicon wafer that meets the cleanliness requirements.

There are several methods for wet cleaning the silicon semiconductor wafer:

RCA Cleaning for Silicon Wafer

Kern et al. proposed the RCA cleaning method in 1965. According to the SPM, DHF, SC-1, and SC-2 sequences, the RCA cleaning method basically satisfies the requirements of most wafer cleanliness. Cleaning the silicon wafers by this method not only improves the cleaning efficiency, reduces the cost, saves time, obtains excellent surface cleanliness, but also improves the electrochemical performance of the Si wafer.

Ultrasonic Cleaning for Silicon Wafer

Ultrasonic cleaning is a cleaning method widely used in the semiconductor industry. The method has the advantages of good cleaning effect, simple operation, and can be removed for complicated devices and containers; but the method also has the disadvantages of high noise and easy breakage of the transducer.

This method can effectively remove organic, particulate, and metal ion impurities on the surface of the silicon wafer by utilizing the mechanical action of high-frequency sound waves, the cavitation effect of the solution, and the complexation reaction of chemical reagents. Using a similar method, BongKyun et al. used a 0.83 MHz megasonic wave to clean the silicon wafer, which is more excellent and can remove particulate impurities below 0.3 μm.

Silicon Wafer Wet Cleaning
Silicon Wafer Wet Cleaning

Double Flow Spray for Silicon Wafer

The dual-flow atomizing nozzle cleans the silicon wafer by using a nozzle to scan the silicon wafer back and forth with the rotating arm, and the silicon wafer rotates clockwise. The dual-flow nozzle uses a high-pressure, high-speed jet of gas to impinge a vulgar flow of liquid, destroying the surface tension of the liquid and the van der Waals bond and hydrogen bond between the liquid molecules, causing the liquid to atomize and become nanometer-sized droplets, which are ejected at high speed through the nozzle under the action of high pressure air.

Ozone Microbubble Method for Silicon Wafer

The high activity and strong oxidizing properties of ozone can remove organic and particulate impurities on the surface of the Si wafers. Ozone is dissolved in water to form a highly reactive OH group, and the OH group chemically reacts with the organic substance to remove organic impurities on the surface of the silicon semiconductor wafer. At the same time, the surface of the silicon product is covered with an atomic-level smooth oxide film, which effectively isolates the re-adsorption of impurities.

This method has an excellent cleaning effect, basically removes organic and particulate impurities, and meets the requirements of general silicon wafer cleanliness. At the same time, ozone microbubble cleaning produces less polluting waste and high cleaning efficiency, and can be used for cleaning large-scale circuits, silicon wafers and LEDs.

For more information, please visit https://www.sputtertargets.net/.

A short analysis of sputtering targets for semiconductor application

Semiconductors have high requirements for the quality and purity of the sputtering materials, which explains why the price of anelva  targets is relatively high.

Undoubtedly, sputtering targets are the most important raw materials in current semiconductor manufacturing processes. Their quality and purity play a key role in the subsequent production quality of the semiconductor industry chain. And anelva targets refer to those sputtering targets used in the semiconductor industry.

Application requirements

Semiconductors have high requirements for the quality and purity of the sputtering materials, which explains why the price of anelva  targets is relatively high. In the semiconductor manufacturing process, if the impurity content of the sputtering target is too high, the formed film cannot achieve the required electrical properties, and it is liable to cause short circuit or damage of the circuit, which will seriously affect the performance of the film.

Therefore, when purchasing semiconductor targets, be sure to find a reliable sputtering targets manufacturers for high-quality & high-purity sputtering targets.

blue computer circuit board closeup , semiconductor industry

Market Size

With the rapid development of terminal applications such as consumer electronics, the market sales of high-purity sputtering targets are expanding.

According to statistics, in 2015, the global high-purity sputtering target market sales reached 9.48 billion US dollars, of which, the semiconductor sputtering target market sales of 1.14 billion US dollars. It is estimated that in the next five years, the market size of the world’s sputtering targets will exceed 16 billion US dollars, and the CAGR (Compound Annual Growth rate) of the high-purity sputtering target market will reach 13%.

According to statistics from WSTS (World Semiconductor Trade Statistics), the global target market is expected to grow at the same rate as 2017 (13%). In 2016, the global sputtering target market capacity was US$11.36 billion, an increase of 20% compared to US$9.48 billion in 2015. It can be inferred that the market size of the global high-purity sputtering target in 2018 is about 14.5 billion US dollars.

Stanford Advanced Materials (SAM) Corporation is a global supplier of sputtering targets such as metals, alloys, oxides and ceramic materials, which are widely used in multiple industries. Please visit https://www.sputtertargets.net/ for more information.

Semiconductor industry: The importance of Anelva target

The sputtering target materials can be divided into metal target (pure metal gold, aluminum, titanium, etc.), alloy target (aluminum-scandium alloy, cobalt-aluminum alloy, aluminum-titanium alloy, etc.) and ceramic compound target (oxides, nitride, silicides, etc.) according to their different chemical compositions; when it comes to different application fields, it can be categorized into semiconductor target, planar display target, solar cell target, and other target materials. Anelva target refers to the sputtering target used in semiconductor industry.

Although the proportion of Anelva target is just about 3% among all the sputtering targets, it cannot be denied that its application in semiconductor chip market is important and irreplaceable. There are generally two kinds of Anelva target: wafer materials and packaging materials. Today we mainly focus on wafer manufacturing materials because they have relatively high technical barriers than the other.

The inner part of the semiconductor is composed of tens of thousands of meters of metal wiring, and the sputtering target material is the key consumption material for making these wiring. In other words, the Anelva target is the core of semiconductor wafer manufacturing. Since the chip is elaborate, it has high requirements for sputtering target material used in the manufacturing process. Generally, the purity of the target material is over 99.999%.

Semiconductor wafers are the basic material for manufacturing chips (as shown below). It is small but complicated. The production of wafer mainly involves 7 kinds of semiconductor materials and chemicals. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravel in the form of silicate or silicon dioxide in nature. The manufacturing process of silicon wafers can be divided into three basic steps: silicon purification, monocrystalline silicon growth, and wafer formation. Apart from silicon, the manufacturing process of 200mm (8-inch) and below wafers is usually mainly made of aluminum, and the manufacture of 300mm (12-inch) wafer mostly uses advanced copper interconnection technology.

Semiconductor wafer

In conclusion, with more extensive use of semiconductor chips, the demand for aluminum, titanium, tantalum and copper, the four mainstream Anelva target, will also increase. There is currently no alternative to these target materials, either technically or economically, so, as I mentioned before,  they are important and irreplaceable.

Please visit https://www.sputtertargets.net/ for more information.

How is tantalum used in phones?

We have talked about the Application of Tantalum Target in Thermal Inkjet Print Head and Copper Plating before, which rises your interest on this element. However, most people think thermal inkjet print and copper plating are far away from their life, thus are difficult to understand. So today, SAM sputter targets will talk about something that EVERYONE is familiar with—your mobile phones.

tantalum

Tantalum is a very important element in the electronic industry. And it is widely used in all kinds of electronic devices, such as phones and computers. The main use of tantalum materials in electronic products comes in the creation of tantalum capacitor. Tantalum capacitors have their unique advantages over other capacitors. They do not use electrolytes like ordinary electrolytic capacitors, making them ideal for operation at high temperatures. Solid tantalum capacitors have excellent electronic properties, wide operating temperature range, various forms and excellent volumetric efficiency.

Continue reading “How is tantalum used in phones?”

Manufacturing process of semiconductor wafer

Semiconductor wafers are the basic material for manufacturing chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravel in the form of silicate or silicon dioxide in nature. The manufacturing process of semiconductor wafers/silicon wafers can be divided into three basic steps: silicon purification, monocrystalline silicon growth, and wafer formation.

Silicon purification

The sandstone material is placed in a 2000 °C electric arc furnace which has a carbon source. At high temperatures, the silica in the carbon and in the sandstone undergoes a chemical reaction (carbon is combined with oxygen, leaving silicon) to obtain pure silicon having a purity of about 98%, also known as metallurgical grade silicon. Continue reading “Manufacturing process of semiconductor wafer”