knowledge Archives - Page 5 of 13

Gold Sputtering Target for Semiconductor Coating

Gold sputtering targets can be deposited on a semiconductor chip such as GaAs, GaP, GaN, or the like by sputtering, and can form an ohmic contact film, an electrode, and a wiring film, thereby improving the conductivity and working efficiency of the semiconductor.

The Physical Vapor Deposition Process for Semiconductor Coatings

Physical vapor deposition (PVD) is a widely used method for depositing thin films onto semiconductor substrates such as silicon wafers. The PVD process involves the transfer of material from a sputtering target or an evaporation source to a substrate. This process is carried out in a vacuum environment to prevent contamination and ensure uniform deposition of the material.

PVD is generally divided into two methods based on the principles involved in the deposition: sputtering and evaporation.

Sputtering: How It Works and Its Variations

Sputtering is like throwing stones into a pool of mud, which will splatter a lot of mud and cover the surface of other objects. Sputtering relies on argon plasma to impact the gold sputter target at high speed, thus sputtering the material near the surface of the target and dropping it onto the wafer to form a gold film.

Sputtering is also divided into direct current (DC) sputtering and radio frequency (RF) sputtering depending on the energy source of the plasma excitation. Basically, both methods can be coated with a metal film. The latter is more directed to non-metallic films such as piezoelectric or magnetic materials. The film formed by sputtering has the characteristics of insulation and a high melting point.

Evaporation: Types and Differences from Sputtering

The evaporation method differs from the heating method and is classified into two types: a thermal coater and an E-gun evaporator. The former is to directly put the pellets prepared for melt evaporation on the heating tungsten wire. Once heated, it will adhere to the heated tungsten wire due to the surface tension of the liquid and then be steamed to the periphery (including the wafer). Due to the limited heat resistance of the heated tungsten wire and the limited space for the molten metal, it is only used for low melting point materials, and the film thickness is limited.

The electron gun-type vaporizer uses an electron beam for heating, and the molten and evaporated metal particles are all placed in a graphite or tungsten crucible. When the metal vapor pressure exceeds the critical limit, it begins to slowly evaporate for four weeks (including wafers). The electron gun-type vaporizer can evaporate a metal with a higher melting point and the thickness is not limited.

Advantages and Applications of Gold Sputtering Targets in the Semiconductor Industry

Gold sputtering targets have several advantages that make them a highly desirable material in the semiconductor industry. One of the most significant advantages of gold sputtering targets is their high electrical conductivity, making them ideal for use in forming electrodes, ohmic contacts, and wiring films in semiconductors. Furthermore, gold sputtering targets are known for their excellent adhesion properties, which ensure a strong bond to the substrate surface.

Conclusion

In conclusion, gold sputtering targets are important materials in semiconductor coating applications, and both sputtering and evaporation are commonly used methods for PVD. The choice of method depends on several factors such as deposition rate, film quality, and adherence of the deposited film required for the application. For more information, please visit https://www.sputtertargets.net/.

The Benefits of Using Chromium Pellets for Thermal Evaporation in Manufacturing

Manufacturing processes have always been evolving, and with the advancements in technology, companies are constantly looking for ways to improve efficiency and reduce costs. One such method that has gained popularity in recent years is the use of chromium pellets for thermal evaporation. These pellets, made of high-purity chromium metal, are used in vacuum deposition processes to create thin films on various substrates. The benefits of using chromium pellets for thermal evaporation are numerous, including improved film quality, reduced manufacturing costs, and increased production rates.

In this article, we will explore the advantages of using chromium pellets in manufacturing and why it has become the preferred method for many industries. So, let’s dive in and discover the world of thermal evaporation and the benefits of using chromium pellets.

What are Chromium Pellets for Thermal Evaporation?

Chromium pellets are small, cylindrical-shaped pieces of high-purity chromium metal that are used in thermal evaporation. Thermal evaporation is a vacuum deposition process, where a material is heated to its evaporation point, and the vaporized material is condensed onto a substrate to form a thin film. Chromium pellets are one of the most popular evaporation materials used in the manufacturing industry, as they offer several advantages over other materials commonly used for thermal evaporation.

Advantages of Using Chromium Pellets

There are several advantages of using chromium pellets for thermal evaporation. The first advantage is improved film quality. Chromium pellets produce high-quality films with excellent adhesion, uniformity, and smoothness. The films produced using chromium pellets are also very stable and have good chemical and mechanical properties, making them ideal for a wide range of applications.

The second advantage of using chromium pellets is reduced manufacturing costs. Chromium pellets have a high evaporation rate, which means that less material is needed to produce the same amount of film. This results in reduced material costs, as well as reduced energy costs, as less energy is required to evaporate the material.

The third advantage is increased production rates. Due to its high evaporation rate, more chromium pellets can be evaporated in a shorter amount of time. This results in increased production rates, which can help companies meet their manufacturing goals faster and more efficiently.

Properties of Chromium Pellets

Chromium pellets are made of high-purity chromium metal, which means that they have excellent physical and chemical properties. Chromium is a hard, lustrous metal that has a high melting point and is resistant to corrosion. Chromium pellets are also very stable and have good mechanical and chemical properties, making them ideal for a wide range of applications.

Comparison of Chromium Pellets with Other Evaporation Materials

Chromium pellets are one of the most popular evaporation materials used in the manufacturing industry, but there are several other materials that are also commonly used. These include aluminum, gold, silver, and copper, among others. While each of these materials has its own advantages and disadvantages, chromium pellets are often preferred due to their excellent film quality, reduced manufacturing costs, and increased production rates.

Applications of Chromium Pellets in Manufacturing

Chromium pellets are used in a wide range of manufacturing applications. Some of the most common applications include the production of thin films for electronics, optics, and solar cells. Chromium pellets are also used in the production of decorative coatings, as well as in the production of hard coatings for cutting tools, molds, and dies.

How to Use Chromium Pellets for Thermal Evaporation

Using chromium pellets for thermal evaporation is a relatively simple process. The first step is to load the pellets into a crucible, which is then placed into the evaporation system. The system is then evacuated to a high vacuum, and the pellets are heated to their evaporation point using an electron beam or resistive heating. The vaporized material is then condensed onto a substrate to form a thin film.

Maintenance and Storage of Chromium Pellets

To ensure the longevity and optimal performance of chromium pellets, proper maintenance, and storage are essential. Chromium pellets should be stored in a dry, cool place, away from moisture and other contaminants. When not in use, the pellets should be stored in an airtight container to prevent oxidation. Before use, the pellets should be cleaned using a mild solvent to remove any surface contaminants.

Where to Buy Chromium Pellets for Thermal Evaporation

Chromium pellets for thermal evaporation can be purchased from a wide range of suppliers. It is important to choose a reputable supplier that offers high-purity chromium pellets that are free from contaminants. One of the most popular suppliers of chromium pellets is Stanford Advanced Material (SAM).

Conclusion

In conclusion, using chromium pellets for thermal evaporation is a highly effective method for producing high-quality films in a wide range of manufacturing applications. The benefits of using chromium pellets include improved film quality, reduced manufacturing costs, and increased production rates. With proper maintenance and storage, chromium pellets can provide optimal performance and longevity, making them an excellent investment for any manufacturing company.

Why Tungsten Crucibles are the Best Choice for E-Beam Evaporation

As technology continues to advance, so does the need for more precise and efficient manufacturing processes. Electron beam evaporation is an important manufacturing process that uses a beam of high-energy electrons to evaporate and deposit materials onto substrates. To obtain the highest quality results, it is essential to use the correct material for the electron beam evaporation processes. Tungsten crucibles have become the go-to choice for many manufacturers due to their exceptional durability and resistance to high temperatures. In this article, we’ll explore the benefits of using tungsten crucibles for e-beam evaporation and why they have become the preferred choice for many industries. So, if you’re looking for a reliable and efficient solution for your e-beam evaporation, read on to learn more about why tungsten crucibles are the best choice.

How Tungsten Crucibles Work in E-Beam Evaporation

Tungsten is a metal that has a high melting point, making it ideal for use in e-beam evaporation that requires high temperatures. Tungsten crucibles are used to hold and contain the material that will be vaporized by the e-beam, such as metals or ceramics. When the e-beam is directed at the material in the crucible, it causes the material to heat up and vaporize, which is then deposited onto the substrate.

Tungsten crucibles are able to withstand the high temperatures generated by the e-beam without melting or deforming. They also have a low vapor pressure, which means that they don’t contaminate the vaporized material with tungsten particles. This is important because any contamination can affect the quality and purity of the deposited material.

Overall, the use of tungsten crucibles in e-beam evaporation allows for precise control of the vaporization process and ensures that the deposited material is of the highest quality.

Advantages of Tungsten Crucibles over Other Materials

Tungsten crucibles have several advantages over other materials that can be used in e-beam evaporation. One of the main advantages is their high melting point, which is over 3400°C. This means that they can withstand the high temperatures generated by the e-beam without melting or deforming.

Another advantage of tungsten crucibles is their low vapor pressure. This means that they don’t contaminate the vaporized material with tungsten particles, which can affect the quality and purity of the deposited material. Tungsten crucibles are also highly resistant to chemical attacks and have a long lifespan, making them a cost-effective choice for e-beam evaporation.

Tungsten Crucibles vs. Graphite Crucibles

Graphite crucibles are another material that can be used in e-beam evaporation. While graphite crucibles have a lower cost than tungsten crucibles, they have several disadvantages. Graphite has a lower melting point than tungsten, which means that it can melt or deform at the high temperatures generated by the e-beam. Graphite crucibles also have a higher vapor pressure than tungsten crucibles, which can result in contamination of the vaporized material.

Tungsten crucibles are a better choice for e-beam evaporation than graphite crucibles due to their higher melting point, lower vapor pressure, and resistance to chemical attack.

Tungsten Crucibles vs. Ceramic Crucibles

Ceramic crucibles are another alternative to tungsten crucibles for e-beam evaporation. While ceramic crucibles are less expensive than tungsten crucibles, they have several disadvantages. Ceramic crucibles have a lower melting point than tungsten, which means that they can melt or deform at the high temperatures generated by the e-beam. Ceramic crucibles are also more brittle than tungsten crucibles, which can result in cracking or breaking during use.

Tungsten crucibles are a better choice for e-beam evaporation than ceramic crucibles due to their higher melting point and resistance to cracking or breaking.

Tungsten Crucibles vs. Molybdenum Crucibles

Molybdenum crucibles are another material that can be used in e-beam evaporation. Molybdenum has a similar melting point to tungsten and is less expensive than tungsten. However, molybdenum has a higher vapor pressure than tungsten, which can result in contamination of the vaporized material.

Tungsten crucibles are a better choice for e-beam evaporation than molybdenum crucibles due to their lower vapor pressure and resistance to chemical attacks.

How to Choose the Right Tungsten Crucible for Your Project

When choosing a tungsten crucible for your e-beam evaporation, there are several factors to consider. The first factor is the size of the crucible, which should be chosen based on the size of the substrate being used. The second factor is the shape of the crucible, which should be chosen based on the geometry of the substrate being used.

The third factor to consider is the thickness of the crucible. Thicker crucibles are more durable and have a longer lifespan, but they also have a higher thermal mass, which can affect the heating and cooling rates of the crucible. Thinner crucibles have a lower thermal mass, which allows for faster heating and cooling rates, but they are also less durable and have a shorter lifespan.

Overall, the choice of tungsten crucible will depend on the specific requirements of your e-beam evaporation and the materials being used.

Maintenance and Care of Tungsten Crucibles

To ensure the longevity and performance of your tungsten crucibles, it’s important to take proper care of them. Tungsten crucibles should be cleaned regularly to remove any contaminants that may affect the quality and purity of the deposited material. They should also be handled carefully to avoid any damage or cracking.

Tungsten crucibles should be stored in a dry and cool environment to prevent any corrosion or oxidation. If a tungsten crucible becomes damaged or cracked, it should be replaced immediately to avoid any contamination of the deposited material.

Conclusion: Why Tungsten Crucibles are the Best Choice for E-Beam Evaporation

Tungsten crucibles have become the go-to choice for many manufacturers due to their exceptional durability and resistance to high temperatures. They offer several advantages over other materials that can be used in e-beam evaporation, including a high melting point, low vapor pressure, and resistance to chemical attack.

While other materials, such as graphite, ceramic, and molybdenum, may be less expensive than tungsten, they have several disadvantages that make tungsten crucibles a better choice for e-beam evaporation. Tungsten crucibles are commonly used in the semiconductor industry for the production of semiconductors, solar cells, and other electronic devices.

When choosing a tungsten crucible for your e-beam evaporation, it’s important to consider factors such as size, shape, and thickness. Proper maintenance and care of tungsten crucibles are also essential to ensure their longevity and performance.

In conclusion, if you’re looking for a reliable and efficient solution for your e-beam evaporation, tungsten crucibles are the best choice. They offer the highest quality results and are a cost-effective option for manufacturers in a variety of industries.

For more information about e-beam evaporation crucibles and related evaporation materials or sources, please visit https://www.sputtertargets.net/.

Understanding the Mechanisms of Vacuum Evaporation Coating

Vacuum evaporation coating is a common method used to deposit thin films onto a substrate. This technique is widely used in a variety of industries, such as electronics, optics, and aerospace, due to its ability to create precise and uniform coatings with a high level of purity. There are several mechanisms used to achieve vacuum evaporation coating, each with its own advantages and limitations.

RESISTANCE EVAPORATION

One common method is resistance evaporation, which uses a resistance evaporation source made of tungsten, molybdenum, or tantalum to evaporate low melting point materials such as gold, silver, zinc sulfide, magnesium fluoride, chromium oxide, and others. However, this method may not meet the needs of vapor deposition of certain metals and non-metals.

ELECTRON BEAM EVAPORATION

Electron beam evaporation is another technique used for vacuum evaporation coating. It involves heating the evaporating material with an electron beam, which can provide a much larger energy density than the resistance heat source. This allows for the heating of refractory metals and non-metallic materials such as tungsten, molybdenum, niobium, SiO2, AI2O3, and others. Additionally, the material to be vapor-deposited is placed in a water-cooled crucible, which helps to avoid evaporation of the container material and reaction between the container material and the membrane material, thus improving the purity of the membrane.

HIGH-FREQUENCY INDUCTION HEATING EVAPORATION

High-frequency induction heating evaporation is another method used for vacuum evaporation coating. The metal is heated to the evaporation temperature using the principle of induction heating. The crucible containing the evaporation material is placed in the center of the spiral coil, and a high-frequency current is passed through the coil to heat the metal evaporation material until evaporation. This method has a large evaporation rate, uniform and stable evaporation source temperature, easy temperature control, and requires less purity of the evaporation materials.

ARC HEATING EVAPORATION

Arc heating evaporation uses the arc discharge heating method, which is similar to the electron beam heating method. This method is particularly suitable for evaporation of refractory metals and graphite that have a high melting point and a certain conductivity. It also has the advantage of being relatively inexpensive compared to the electron beam heating apparatus.

CONCLUSION

In conclusion, vacuum evaporation coating is a versatile and widely used technique for depositing thin films onto a substrate. There are several methods used to achieve this, each with its own advantages and limitations. By understanding the different mechanisms of vacuum evaporation coating, researchers and industry professionals can choose the appropriate method to achieve the desired coating properties for their specific applications.

If you want to learn more about sputtering targets, such as metals, alloys, oxides, and ceramic materials, you can visit the website of Stanford Advanced Materials (SAM) Corporation at https://www.sputtertargets.net/. SAM is a global supplier of various sputtering targets and regularly updates their knowledge and interesting stories related to sputtering targets on their website.

Requirements of The Width of ITO Glass: Thinner Is Better?

In recent years, the requirements for processing technology in various industries have been continuously improved. Taking ITO materials as an example, the line width and interval of processing ITO conductive patterns have higher requirements. And often there is such a question, can the ITO laser etching machine be able to achieve a line width below 20 microns? Can the processing interval be 20 microns? The answer is yes. So what is the smallest line width of the ITO laser etching machine? Let SAM Sputter Target answer it for you.

Further Reading: An Introduction to ITO – Indium Tin Oxide

The thickness of the ITO line width is determined by the laser and the optics and relates to the spot size of the focus and the thermal influence of the source on the material. Shorter wavelength results in lower energy, narrower pulse width, higher magnification of the beam expander, smaller negative of the field lens, and smaller spot size, so it could produce a line with thinner width. Of course, several of the above-mentioned parameters have a relative limit value. For example, if the magnification of the beam expander is too high, the energy density will be poor, which is not suitable for processing. Therefore, we need to take a range of values in order to apply them to the processing needs.

In addition, even with the same laser etch machine, the line widths made by different materials are different. For example, the etch line width of a nickel alloy material is thicker than that of an ITO material, depending on the absorption of the laser wavelength by the material itself. This article analyzes based on ITO conductive glass.

In the current laser market, the minimum line width of ITO conductive glass is 5 micrometers, and different line widths can be selectively selected according to different light sources. For example, the minimum line width of an ultraviolet nanosecond laser can be 15 micrometers. Of course, there are also EUV lithography machines that can achieve nanometer levels by means of extreme ultraviolet lasers. The requirements for line width are mainly determined by different product requirements.

ITO Glass – Thinner Is Better?

In recent years, the requirements for processing technology in various industries have been continuously improved. ITO (indium tin oxide) materials, for instance, have stricter criteria for line width and processing interval for ITO conductive patterns. The subject of whether the ITO laser etching machine can produce lines smaller than 20 microns comes up frequently. Is a 20-micron processing interval possible? The answer is yes. So what is the smallest line width of the ITO laser etching machine? Let SAM Sputter Target answer it for you.

What Determines the Line Width?

The laser and the optics define the thickness of the ITO line width, which is related to the size of the focus spot and the thermal impact of the source on the material. A line with a thinner width might be produced by a shorter wavelength because it has lower energy, a narrower pulse width, a higher beam expander magnification, a smaller field lens negative, and a smaller spot size. Several of the aforementioned parameters, of course, have a relative limit value. For instance, if the beam expander’s magnification is too great, the energy density will be inadequate and unsuitable for processing. As a result, we must choose a variety of values and apply them to the processing requirements.

Thickness Requirements of Different Industries

The general requirement for ITO glass in the touch screen industry is less than 20 microns, which uses a narrow pulse-width infrared nanosecond laser. Different industries have different requirements for ITO line width. In some industries, the resistance of ITO line width has relatively high requirements, while in some industries, it is required to ensure that it is cut and insulated. In the current laser market, the minimum line width of ITO conductive glass is 5 micrometers, and different line widths can be selectively selected according to different light sources. For example, the minimum line width of an ultraviolet nanosecond laser can be 15 micrometers. Of course, there are also EUV lithography machines that can achieve nanometer levels by means of extreme ultraviolet lasers. The requirements for line width are mainly determined by different product requirements.

Thinner is Better?

From the above, you can see that different industries have different thickness requirements for ITO glass. What is certain is that the thinner is not always the better. It still needs to be designed and manufactured according to the specific application.

Differences Between CVD and PVD Processes and Technologies

The most popular surface treatment technologies, chemical vapor deposition (CVD) and physical vapor deposition (PVD), have been used extensively for nearly 50 years to harden the surfaces of tools and molds. The context that follows compares the technologies and processes of CVD and PVD using the illustration of cutting tools.

Rationale

In the process known as chemical vapor deposition (CVD), a vapor containing a gaseous reactant or a liquid reactant that makes up a thin film element as well as other gases necessary for the reaction are introduced into a reaction chamber in order to chemically react on the surface of the substrate to form a thin film.

Physical vapor deposition (PVD) uses low-voltage, high-current arc discharge technology under vacuum conditions to evaporate the target and ionize the vaporized material and the gas, and finally make the evaporated material and its reaction deposited on the workpiece.

Image Credit: Stanford Advanced Materials

Process and Equipment

1. Temperature

The fundamental distinction between CVD and PVD is temperature. The tools must undergo a vacuum heat treatment after coating since the process temperature of the CVD method is higher than the high-speed steel’s tempering temperature. This will restore the tools’ hardness.

2. Compared to PVD, the CVD method requires less cleaning of the tool entering the reactor.

3. The PVD coating (approximately 2.5 m) is thinner than the CVD coating (about 7.5 m) on the tool’s surface.

4. The CVD coating’s surface is marginally rougher than the substrate’s surface. On the other hand, the PVD coating has a good metallic sheen without grinding and effectively reflects the tool’s surface.

5. The crafting process

CVD has good coating performance and takes place in a gaseous atmosphere with low vacuum. Hence, every surface of the cutters encased in the reactor, including deep holes and inner walls, can be entirely coated, with the exception of the support points.

In contrast, all PVD technologies have poor coating performance both on the back and sides of the tool due to low air pressure. To prevent the production of shadows, the PVD reactor must minimize its loading density, and loading and fixing are challenging. In a PVD reactor, the tool typically revolves constantly, though occasionally it must also reciprocate.

6. Cost

Although the PVD production cycle is one-tenth that of CVD, the initial equipment expenditure is three to four times that of CVD. Whereas PVD is severely constrained, a wide range of workpieces can be treated within a CVD operating cycle. In other words, PVD can cost more than CVD in some cases.

7. Safety

As a form of “green engineering,” PVD creates less pollution when operating. Contrarily, the reactive gas and reaction tail gas of CVD may have some corrosiveness, flammability, and toxicity, and the reaction tail gas may contain powdered and fragmented chemicals, thus particular precautions for the equipment, environment, and operators must be taken.

Stanford Advanced Materials supplies high-quality and consistent products to meet our customers’ R&D and production needs. You can visit our website for more information.

6 Facts About Semiconductor Wafers

1. Semiconductor, as it literally seems to be, is a solid substance whose conductivity is between insulators and most metals, either due to the addition of an impurity or because of temperature effects. In other words, the conductivity of the semiconductor can be controlled by adding impurities as a specific amount of other materials to the semiconductor.

2. Most semiconductor wafers are made of silicon, which is the second-most abundant element in the Earth’s crust (about 28% by mass) after oxygen and the eighth-most common element in the entire universe by mass. In addition to silicon, semiconductors also use other materials, including germanium, gallium arsenide, germanium, indium phosphide, sapphire and quartz.

3. Semiconductor wafers are available in a spread of diameters. The first semiconductor wafer made in the US in 1960 was just 1 inch in diameter. Today, standard semiconductor wafers go up from 12 inches to 18 inches.

4. Water is the key component of manufacturing Silicon wafers. It is a compound that basically is a general solvent for all substances, silicon included. A large production facility uses up to 4.8 million gallons of water every day to supply Silicon wafers for manufacturing needs and supply.

5. The thickness of semiconductor wafers varies greatly. The thickness of the wafer is always determined by the mechanical strength of any material used to make it. Regardless of what the semiconductor is made of, the wafer must be thick enough to support its own weight so that it does not break during processing.

6. Contamination is inevitable during the manufacture and transportation of semiconductors. Appropriate storage conditions must be in place to prevent contamination and/or degradation after shipment. Semiconductor wafers that are not vacuum sealed must be placed in a Nitrogen (N2) cabinet at a flow rate of 2 to 6 SCFH (Standard Cubic Feet per Hour).

Stanford Advanced Materials (SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

Application of Molybdenum Target in Mobile Phone LCD Screen

Nowadays, society is full of phubbers, and mobile phones have become the most indispensable thing for the masses. Mobile phone displays are also becoming more and more high-end, such as full-screen design, small bang design, and so on.

Do you know what the important step is in making a mobile phone LCD screen? — Coating, using magnetron sputtering to sputter metal molybdenum from the molybdenum target onto the liquid crystal glass.

As an advanced film material preparation technology, sputtering has two characteristics of “high speed” and “low temperature”. It concentrates ions into a high-speed ion stream in a vacuum to bombard a solid surface. The kinetic energy exchange between the ions and the atoms on the solid surface causes the atoms on the solid surface to leave the target and deposit on the surface of the substrate to form a nano (or micro) film. The bombarded solid is a material for depositing a thin film by sputtering, which is called a sputtering target.

In the electronics industry, molybdenum sputtering targets are mainly used for flat panel displays, electrodes and wiring materials for thin film solar cells, and barrier materials for semiconductors. These are based on its high melting point, high electrical conductivity, low specific impedance, good corrosion resistance, and good environmental performance.

Molybdenum used in components of LCDs can greatly improve the brightness, contrast, color, and life of the LCD. One of the major applications for molybdenum sputtering targets in the flat panel display industry is in the TFT-LCD field.

In addition to the flat panel display industry, with the development of the new energy industry, the application of molybdenum sputtering targets on thin film solar photovoltaic cells is also increasing. The molybdenum sputtering target mainly forms a CIGS (Copper Indium Gallium Selenide) thin-film battery electrode layer by sputtering. Among them, molybdenum is at the bottom of the solar cell, and is a back contact of the solar cell. It plays an important role in the nucleation, growth, and morphology of the CIGS thin film crystal.

Stanford Advanced Materials(SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

3 Minutes to Know PVD Gold Sputtering

Gold is a popular precious metal that has been used for centuries as currency, hedging and jewelry for its noble and beautiful gold color.

PVD Gold Sputtering

Gold sputtering coating is a thin film deposition process in which gold or gold alloy is bombarded with high-energy ions in a vacuum chamber, causing gold atoms or molecules to be “sputtered” into the vapor and condensed on the substrate to be coated. Sputtering is one method of the PVD (Physical Vapor Deposition) process, the other two of which are thermal evaporation deposition and electron beam vapor deposition, and gold is also applied in these two methods. In thermal evaporation deposition, gold evaporates in a low-pressure environment with resistive heating elements; and in electron beam vapor deposition, gold is heated by an electron beam, and then condensed on the substrate to be coated.

Gold Plating

Apart from PVD coating, there are other ways for gold coatings such as gold plating and gold filling. Gold plating is a method that deposits a thin layer of gold on the surface of another metal by chemical or electrochemical plating. The advantages of gold plating are inexpensive and easy. However, the coating it produces is relatively soft and less durable, and what’s worse, its chemical process would cause pollution that is far away from environmentally friendly.

Gold Filling

Gold filling is the mechanical bonding of gold to metal under high temperatures and pressure. It produces a thicker coating than PVD gold sputtering and gold plating, and thus it is usually more expensive.

Advantages of PVD gold sputtering

The constant contact of skin or clothing may abrade the coatings, especially in the watch and jewelry industry. Thus, PVD gold sputtering is preferred in these two industries because the coatings it produces are harder and more durable than that of electrolytic gold plating or gold filling.

Compared to other types of gold coatings, the main advantages of PVD gold sputtering coating are their durability, retention of gloss, corrosion resistance, and abrasion resistance in contact with the skin, thus extending the life of the jewelry. PVD gold sputtering not only provides the exact color and brightness which evokes the general feeling of love and attraction with jewelry, but also has the advantage of being more environmentally friendly and durable than gold plating or gold filling for producing a gold coating.

Stanford Advanced Materials(SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs.

M	T	W	T	F	S	S
« Nov
						1
2	3	4	5	6	7	8
9	10	11	12	13	14	15
16	17	18	19	20	21	22
23	24	25	26	27	28	29
30	31