SAM Sputter Targets, Author at SAM Sputter Targets

Can Back Target Material be Reused?

Back target materials are an essential component in the sputtering process and play a crucial role in determining the performance of thin film deposition. They serve as a support for sputtering targets, absorbing and dissipating heat generated during sputtering. It is essential to choose a suitable back target material that has good thermal conductivity, stability, and compatibility with the sputtering targets.

Furthermore, it is important to know whether the back target material can be reused or not. In this article, we will discuss the commonly used back target materials in sputtering and analyze whether they can be reused or not.

Analysis of Common Back Target Materials

Oxygen-Free Copper (OFC)

Oxygen-free copper is the most commonly used back target material due to its good electrical and thermal conductivity. Moreover, OFC is also known for its ability to withstand high temperatures. With proper maintenance and care, an oxygen-free copper back target can be reused 10 times or more.

Molybdenum (Mo)

In cases where special conditions of use are required, oxygen-free copper may not serve the purpose as it can get oxidized and warped if high-temperature bonding is necessary. Therefore, molybdenum metal is used as the back target material because of its excellent thermal and electrical conductivity. Moreover, metallic molybdenum is also required as a backing material for certain ceramics and metal targets that do not have a coefficient of thermal expansion that matches oxygen-free copper.

Stainless Steel Tube (SST)

Stainless steel tubes are commonly used as a backing tube for rotating targets as they offer good strength and thermal conductivity and are very economical. They are ideal for use as a backing tube because of their resistance to corrosion and low magnetic permeability.

Can Back Target Materials be Reused?

Most back target materials can be reused, especially with metal indium for the back target, which is easier to clean and reuse compared to other materials. However, if the back target is coated with other adhesives, such as epoxy, it may be necessary to use mechanical treatment to treat the back target surface before reuse.

Conclusion

Choosing the right back target material is crucial for sputtering applications. While oxygen-free copper is the most commonly used back target material, molybdenum, and stainless steel tubes are also widely used for their unique properties.

To get high-quality sputtering targets and evaporation materials, Stanford Advanced Materials (SAM) Corporation is your best option. As a global supplier, we offer a wide range of sputtering targets such as metals, alloys, oxides, and ceramic materials, all of which have high purity. Additionally, we offer target bonding services to meet all of your needs. Visit our website at https://www.sputtertargets.net/ for more information.

Gold Sputtering Target for Semiconductor Coating

Gold sputtering targets can be deposited on a semiconductor chip such as GaAs, GaP, GaN, or the like by sputtering, and can form an ohmic contact film, an electrode, and a wiring film, thereby improving the conductivity and working efficiency of the semiconductor.

The Physical Vapor Deposition Process for Semiconductor Coatings

Physical vapor deposition (PVD) is a widely used method for depositing thin films onto semiconductor substrates such as silicon wafers. The PVD process involves the transfer of material from a sputtering target or an evaporation source to a substrate. This process is carried out in a vacuum environment to prevent contamination and ensure uniform deposition of the material.

PVD is generally divided into two methods based on the principles involved in the deposition: sputtering and evaporation.

Sputtering: How It Works and Its Variations

Sputtering is like throwing stones into a pool of mud, which will splatter a lot of mud and cover the surface of other objects. Sputtering relies on argon plasma to impact the gold sputter target at high speed, thus sputtering the material near the surface of the target and dropping it onto the wafer to form a gold film.

Sputtering is also divided into direct current (DC) sputtering and radio frequency (RF) sputtering depending on the energy source of the plasma excitation. Basically, both methods can be coated with a metal film. The latter is more directed to non-metallic films such as piezoelectric or magnetic materials. The film formed by sputtering has the characteristics of insulation and a high melting point.

Evaporation: Types and Differences from Sputtering

The evaporation method differs from the heating method and is classified into two types: a thermal coater and an E-gun evaporator. The former is to directly put the pellets prepared for melt evaporation on the heating tungsten wire. Once heated, it will adhere to the heated tungsten wire due to the surface tension of the liquid and then be steamed to the periphery (including the wafer). Due to the limited heat resistance of the heated tungsten wire and the limited space for the molten metal, it is only used for low melting point materials, and the film thickness is limited.

The electron gun-type vaporizer uses an electron beam for heating, and the molten and evaporated metal particles are all placed in a graphite or tungsten crucible. When the metal vapor pressure exceeds the critical limit, it begins to slowly evaporate for four weeks (including wafers). The electron gun-type vaporizer can evaporate a metal with a higher melting point and the thickness is not limited.

Advantages and Applications of Gold Sputtering Targets in the Semiconductor Industry

Gold sputtering targets have several advantages that make them a highly desirable material in the semiconductor industry. One of the most significant advantages of gold sputtering targets is their high electrical conductivity, making them ideal for use in forming electrodes, ohmic contacts, and wiring films in semiconductors. Furthermore, gold sputtering targets are known for their excellent adhesion properties, which ensure a strong bond to the substrate surface.

Conclusion

In conclusion, gold sputtering targets are important materials in semiconductor coating applications, and both sputtering and evaporation are commonly used methods for PVD. The choice of method depends on several factors such as deposition rate, film quality, and adherence of the deposited film required for the application. For more information, please visit https://www.sputtertargets.net/.

The Benefits of Using Chromium Pellets for Thermal Evaporation in Manufacturing

Manufacturing processes have always been evolving, and with the advancements in technology, companies are constantly looking for ways to improve efficiency and reduce costs. One such method that has gained popularity in recent years is the use of chromium pellets for thermal evaporation. These pellets, made of high-purity chromium metal, are used in vacuum deposition processes to create thin films on various substrates. The benefits of using chromium pellets for thermal evaporation are numerous, including improved film quality, reduced manufacturing costs, and increased production rates.

In this article, we will explore the advantages of using chromium pellets in manufacturing and why it has become the preferred method for many industries. So, let’s dive in and discover the world of thermal evaporation and the benefits of using chromium pellets.

What are Chromium Pellets for Thermal Evaporation?

Chromium pellets are small, cylindrical-shaped pieces of high-purity chromium metal that are used in thermal evaporation. Thermal evaporation is a vacuum deposition process, where a material is heated to its evaporation point, and the vaporized material is condensed onto a substrate to form a thin film. Chromium pellets are one of the most popular evaporation materials used in the manufacturing industry, as they offer several advantages over other materials commonly used for thermal evaporation.

Advantages of Using Chromium Pellets

There are several advantages of using chromium pellets for thermal evaporation. The first advantage is improved film quality. Chromium pellets produce high-quality films with excellent adhesion, uniformity, and smoothness. The films produced using chromium pellets are also very stable and have good chemical and mechanical properties, making them ideal for a wide range of applications.

The second advantage of using chromium pellets is reduced manufacturing costs. Chromium pellets have a high evaporation rate, which means that less material is needed to produce the same amount of film. This results in reduced material costs, as well as reduced energy costs, as less energy is required to evaporate the material.

The third advantage is increased production rates. Due to its high evaporation rate, more chromium pellets can be evaporated in a shorter amount of time. This results in increased production rates, which can help companies meet their manufacturing goals faster and more efficiently.

Properties of Chromium Pellets

Chromium pellets are made of high-purity chromium metal, which means that they have excellent physical and chemical properties. Chromium is a hard, lustrous metal that has a high melting point and is resistant to corrosion. Chromium pellets are also very stable and have good mechanical and chemical properties, making them ideal for a wide range of applications.

Comparison of Chromium Pellets with Other Evaporation Materials

Chromium pellets are one of the most popular evaporation materials used in the manufacturing industry, but there are several other materials that are also commonly used. These include aluminum, gold, silver, and copper, among others. While each of these materials has its own advantages and disadvantages, chromium pellets are often preferred due to their excellent film quality, reduced manufacturing costs, and increased production rates.

Applications of Chromium Pellets in Manufacturing

Chromium pellets are used in a wide range of manufacturing applications. Some of the most common applications include the production of thin films for electronics, optics, and solar cells. Chromium pellets are also used in the production of decorative coatings, as well as in the production of hard coatings for cutting tools, molds, and dies.

How to Use Chromium Pellets for Thermal Evaporation

Using chromium pellets for thermal evaporation is a relatively simple process. The first step is to load the pellets into a crucible, which is then placed into the evaporation system. The system is then evacuated to a high vacuum, and the pellets are heated to their evaporation point using an electron beam or resistive heating. The vaporized material is then condensed onto a substrate to form a thin film.

Maintenance and Storage of Chromium Pellets

To ensure the longevity and optimal performance of chromium pellets, proper maintenance, and storage are essential. Chromium pellets should be stored in a dry, cool place, away from moisture and other contaminants. When not in use, the pellets should be stored in an airtight container to prevent oxidation. Before use, the pellets should be cleaned using a mild solvent to remove any surface contaminants.

Where to Buy Chromium Pellets for Thermal Evaporation

Chromium pellets for thermal evaporation can be purchased from a wide range of suppliers. It is important to choose a reputable supplier that offers high-purity chromium pellets that are free from contaminants. One of the most popular suppliers of chromium pellets is Stanford Advanced Material (SAM).

Conclusion

In conclusion, using chromium pellets for thermal evaporation is a highly effective method for producing high-quality films in a wide range of manufacturing applications. The benefits of using chromium pellets include improved film quality, reduced manufacturing costs, and increased production rates. With proper maintenance and storage, chromium pellets can provide optimal performance and longevity, making them an excellent investment for any manufacturing company.

Why Tungsten Crucibles are the Best Choice for E-Beam Evaporation

As technology continues to advance, so does the need for more precise and efficient manufacturing processes. Electron beam evaporation is an important manufacturing process that uses a beam of high-energy electrons to evaporate and deposit materials onto substrates. To obtain the highest quality results, it is essential to use the correct material for the electron beam evaporation processes. Tungsten crucibles have become the go-to choice for many manufacturers due to their exceptional durability and resistance to high temperatures. In this article, we’ll explore the benefits of using tungsten crucibles for e-beam evaporation and why they have become the preferred choice for many industries. So, if you’re looking for a reliable and efficient solution for your e-beam evaporation, read on to learn more about why tungsten crucibles are the best choice.

How Tungsten Crucibles Work in E-Beam Evaporation

Tungsten is a metal that has a high melting point, making it ideal for use in e-beam evaporation that requires high temperatures. Tungsten crucibles are used to hold and contain the material that will be vaporized by the e-beam, such as metals or ceramics. When the e-beam is directed at the material in the crucible, it causes the material to heat up and vaporize, which is then deposited onto the substrate.

Tungsten crucibles are able to withstand the high temperatures generated by the e-beam without melting or deforming. They also have a low vapor pressure, which means that they don’t contaminate the vaporized material with tungsten particles. This is important because any contamination can affect the quality and purity of the deposited material.

Overall, the use of tungsten crucibles in e-beam evaporation allows for precise control of the vaporization process and ensures that the deposited material is of the highest quality.

Advantages of Tungsten Crucibles over Other Materials

Tungsten crucibles have several advantages over other materials that can be used in e-beam evaporation. One of the main advantages is their high melting point, which is over 3400°C. This means that they can withstand the high temperatures generated by the e-beam without melting or deforming.

Another advantage of tungsten crucibles is their low vapor pressure. This means that they don’t contaminate the vaporized material with tungsten particles, which can affect the quality and purity of the deposited material. Tungsten crucibles are also highly resistant to chemical attacks and have a long lifespan, making them a cost-effective choice for e-beam evaporation.

Tungsten Crucibles vs. Graphite Crucibles

Graphite crucibles are another material that can be used in e-beam evaporation. While graphite crucibles have a lower cost than tungsten crucibles, they have several disadvantages. Graphite has a lower melting point than tungsten, which means that it can melt or deform at the high temperatures generated by the e-beam. Graphite crucibles also have a higher vapor pressure than tungsten crucibles, which can result in contamination of the vaporized material.

Tungsten crucibles are a better choice for e-beam evaporation than graphite crucibles due to their higher melting point, lower vapor pressure, and resistance to chemical attack.

Tungsten Crucibles vs. Ceramic Crucibles

Ceramic crucibles are another alternative to tungsten crucibles for e-beam evaporation. While ceramic crucibles are less expensive than tungsten crucibles, they have several disadvantages. Ceramic crucibles have a lower melting point than tungsten, which means that they can melt or deform at the high temperatures generated by the e-beam. Ceramic crucibles are also more brittle than tungsten crucibles, which can result in cracking or breaking during use.

Tungsten crucibles are a better choice for e-beam evaporation than ceramic crucibles due to their higher melting point and resistance to cracking or breaking.

Tungsten Crucibles vs. Molybdenum Crucibles

Molybdenum crucibles are another material that can be used in e-beam evaporation. Molybdenum has a similar melting point to tungsten and is less expensive than tungsten. However, molybdenum has a higher vapor pressure than tungsten, which can result in contamination of the vaporized material.

Tungsten crucibles are a better choice for e-beam evaporation than molybdenum crucibles due to their lower vapor pressure and resistance to chemical attacks.

How to Choose the Right Tungsten Crucible for Your Project

When choosing a tungsten crucible for your e-beam evaporation, there are several factors to consider. The first factor is the size of the crucible, which should be chosen based on the size of the substrate being used. The second factor is the shape of the crucible, which should be chosen based on the geometry of the substrate being used.

The third factor to consider is the thickness of the crucible. Thicker crucibles are more durable and have a longer lifespan, but they also have a higher thermal mass, which can affect the heating and cooling rates of the crucible. Thinner crucibles have a lower thermal mass, which allows for faster heating and cooling rates, but they are also less durable and have a shorter lifespan.

Overall, the choice of tungsten crucible will depend on the specific requirements of your e-beam evaporation and the materials being used.

Maintenance and Care of Tungsten Crucibles

To ensure the longevity and performance of your tungsten crucibles, it’s important to take proper care of them. Tungsten crucibles should be cleaned regularly to remove any contaminants that may affect the quality and purity of the deposited material. They should also be handled carefully to avoid any damage or cracking.

Tungsten crucibles should be stored in a dry and cool environment to prevent any corrosion or oxidation. If a tungsten crucible becomes damaged or cracked, it should be replaced immediately to avoid any contamination of the deposited material.

Conclusion: Why Tungsten Crucibles are the Best Choice for E-Beam Evaporation

Tungsten crucibles have become the go-to choice for many manufacturers due to their exceptional durability and resistance to high temperatures. They offer several advantages over other materials that can be used in e-beam evaporation, including a high melting point, low vapor pressure, and resistance to chemical attack.

While other materials, such as graphite, ceramic, and molybdenum, may be less expensive than tungsten, they have several disadvantages that make tungsten crucibles a better choice for e-beam evaporation. Tungsten crucibles are commonly used in the semiconductor industry for the production of semiconductors, solar cells, and other electronic devices.

When choosing a tungsten crucible for your e-beam evaporation, it’s important to consider factors such as size, shape, and thickness. Proper maintenance and care of tungsten crucibles are also essential to ensure their longevity and performance.

In conclusion, if you’re looking for a reliable and efficient solution for your e-beam evaporation, tungsten crucibles are the best choice. They offer the highest quality results and are a cost-effective option for manufacturers in a variety of industries.

For more information about e-beam evaporation crucibles and related evaporation materials or sources, please visit https://www.sputtertargets.net/.

Understanding the Mechanisms of Vacuum Evaporation Coating

Vacuum evaporation coating is a common method used to deposit thin films onto a substrate. This technique is widely used in a variety of industries, such as electronics, optics, and aerospace, due to its ability to create precise and uniform coatings with a high level of purity. There are several mechanisms used to achieve vacuum evaporation coating, each with its own advantages and limitations.

RESISTANCE EVAPORATION

One common method is resistance evaporation, which uses a resistance evaporation source made of tungsten, molybdenum, or tantalum to evaporate low melting point materials such as gold, silver, zinc sulfide, magnesium fluoride, chromium oxide, and others. However, this method may not meet the needs of vapor deposition of certain metals and non-metals.

ELECTRON BEAM EVAPORATION

Electron beam evaporation is another technique used for vacuum evaporation coating. It involves heating the evaporating material with an electron beam, which can provide a much larger energy density than the resistance heat source. This allows for the heating of refractory metals and non-metallic materials such as tungsten, molybdenum, niobium, SiO2, AI2O3, and others. Additionally, the material to be vapor-deposited is placed in a water-cooled crucible, which helps to avoid evaporation of the container material and reaction between the container material and the membrane material, thus improving the purity of the membrane.

HIGH-FREQUENCY INDUCTION HEATING EVAPORATION

High-frequency induction heating evaporation is another method used for vacuum evaporation coating. The metal is heated to the evaporation temperature using the principle of induction heating. The crucible containing the evaporation material is placed in the center of the spiral coil, and a high-frequency current is passed through the coil to heat the metal evaporation material until evaporation. This method has a large evaporation rate, uniform and stable evaporation source temperature, easy temperature control, and requires less purity of the evaporation materials.

ARC HEATING EVAPORATION

Arc heating evaporation uses the arc discharge heating method, which is similar to the electron beam heating method. This method is particularly suitable for evaporation of refractory metals and graphite that have a high melting point and a certain conductivity. It also has the advantage of being relatively inexpensive compared to the electron beam heating apparatus.

CONCLUSION

In conclusion, vacuum evaporation coating is a versatile and widely used technique for depositing thin films onto a substrate. There are several methods used to achieve this, each with its own advantages and limitations. By understanding the different mechanisms of vacuum evaporation coating, researchers and industry professionals can choose the appropriate method to achieve the desired coating properties for their specific applications.

If you want to learn more about sputtering targets, such as metals, alloys, oxides, and ceramic materials, you can visit the website of Stanford Advanced Materials (SAM) Corporation at https://www.sputtertargets.net/. SAM is a global supplier of various sputtering targets and regularly updates their knowledge and interesting stories related to sputtering targets on their website.

Requirements of The Width of ITO Glass: Thinner Is Better?

In recent years, the requirements for processing technology in various industries have been continuously improved. Taking ITO materials as an example, the line width and interval of processing ITO conductive patterns have higher requirements. And often there is such a question, can the ITO laser etching machine be able to achieve a line width below 20 microns? Can the processing interval be 20 microns? The answer is yes. So what is the smallest line width of the ITO laser etching machine? Let SAM Sputter Target answer it for you.

Further Reading: An Introduction to ITO – Indium Tin Oxide

The thickness of the ITO line width is determined by the laser and the optics and relates to the spot size of the focus and the thermal influence of the source on the material. Shorter wavelength results in lower energy, narrower pulse width, higher magnification of the beam expander, smaller negative of the field lens, and smaller spot size, so it could produce a line with thinner width. Of course, several of the above-mentioned parameters have a relative limit value. For example, if the magnification of the beam expander is too high, the energy density will be poor, which is not suitable for processing. Therefore, we need to take a range of values in order to apply them to the processing needs.

In addition, even with the same laser etch machine, the line widths made by different materials are different. For example, the etch line width of a nickel alloy material is thicker than that of an ITO material, depending on the absorption of the laser wavelength by the material itself. This article analyzes based on ITO conductive glass.

In the current laser market, the minimum line width of ITO conductive glass is 5 micrometers, and different line widths can be selectively selected according to different light sources. For example, the minimum line width of an ultraviolet nanosecond laser can be 15 micrometers. Of course, there are also EUV lithography machines that can achieve nanometer levels by means of extreme ultraviolet lasers. The requirements for line width are mainly determined by different product requirements.

ITO Glass – Thinner Is Better?

In recent years, the requirements for processing technology in various industries have been continuously improved. ITO (indium tin oxide) materials, for instance, have stricter criteria for line width and processing interval for ITO conductive patterns. The subject of whether the ITO laser etching machine can produce lines smaller than 20 microns comes up frequently. Is a 20-micron processing interval possible? The answer is yes. So what is the smallest line width of the ITO laser etching machine? Let SAM Sputter Target answer it for you.

What Determines the Line Width?

The laser and the optics define the thickness of the ITO line width, which is related to the size of the focus spot and the thermal impact of the source on the material. A line with a thinner width might be produced by a shorter wavelength because it has lower energy, a narrower pulse width, a higher beam expander magnification, a smaller field lens negative, and a smaller spot size. Several of the aforementioned parameters, of course, have a relative limit value. For instance, if the beam expander’s magnification is too great, the energy density will be inadequate and unsuitable for processing. As a result, we must choose a variety of values and apply them to the processing requirements.

Thickness Requirements of Different Industries

The general requirement for ITO glass in the touch screen industry is less than 20 microns, which uses a narrow pulse-width infrared nanosecond laser. Different industries have different requirements for ITO line width. In some industries, the resistance of ITO line width has relatively high requirements, while in some industries, it is required to ensure that it is cut and insulated. In the current laser market, the minimum line width of ITO conductive glass is 5 micrometers, and different line widths can be selectively selected according to different light sources. For example, the minimum line width of an ultraviolet nanosecond laser can be 15 micrometers. Of course, there are also EUV lithography machines that can achieve nanometer levels by means of extreme ultraviolet lasers. The requirements for line width are mainly determined by different product requirements.

Thinner is Better?

From the above, you can see that different industries have different thickness requirements for ITO glass. What is certain is that the thinner is not always the better. It still needs to be designed and manufactured according to the specific application.

Differences Between CVD and PVD Processes and Technologies

The most popular surface treatment technologies, chemical vapor deposition (CVD) and physical vapor deposition (PVD), have been used extensively for nearly 50 years to harden the surfaces of tools and molds. The context that follows compares the technologies and processes of CVD and PVD using the illustration of cutting tools.

Rationale

In the process known as chemical vapor deposition (CVD), a vapor containing a gaseous reactant or a liquid reactant that makes up a thin film element as well as other gases necessary for the reaction are introduced into a reaction chamber in order to chemically react on the surface of the substrate to form a thin film.

Physical vapor deposition (PVD) uses low-voltage, high-current arc discharge technology under vacuum conditions to evaporate the target and ionize the vaporized material and the gas, and finally make the evaporated material and its reaction deposited on the workpiece.

Image Credit: Stanford Advanced Materials

Process and Equipment

1. Temperature

The fundamental distinction between CVD and PVD is temperature. The tools must undergo a vacuum heat treatment after coating since the process temperature of the CVD method is higher than the high-speed steel’s tempering temperature. This will restore the tools’ hardness.

2. Compared to PVD, the CVD method requires less cleaning of the tool entering the reactor.

3. The PVD coating (approximately 2.5 m) is thinner than the CVD coating (about 7.5 m) on the tool’s surface.

4. The CVD coating’s surface is marginally rougher than the substrate’s surface. On the other hand, the PVD coating has a good metallic sheen without grinding and effectively reflects the tool’s surface.

5. The crafting process

CVD has good coating performance and takes place in a gaseous atmosphere with low vacuum. Hence, every surface of the cutters encased in the reactor, including deep holes and inner walls, can be entirely coated, with the exception of the support points.

In contrast, all PVD technologies have poor coating performance both on the back and sides of the tool due to low air pressure. To prevent the production of shadows, the PVD reactor must minimize its loading density, and loading and fixing are challenging. In a PVD reactor, the tool typically revolves constantly, though occasionally it must also reciprocate.

6. Cost

Although the PVD production cycle is one-tenth that of CVD, the initial equipment expenditure is three to four times that of CVD. Whereas PVD is severely constrained, a wide range of workpieces can be treated within a CVD operating cycle. In other words, PVD can cost more than CVD in some cases.

7. Safety

As a form of “green engineering,” PVD creates less pollution when operating. Contrarily, the reactive gas and reaction tail gas of CVD may have some corrosiveness, flammability, and toxicity, and the reaction tail gas may contain powdered and fragmented chemicals, thus particular precautions for the equipment, environment, and operators must be taken.

Stanford Advanced Materials supplies high-quality and consistent products to meet our customers’ R&D and production needs. You can visit our website for more information.

The Role of Sputtering Targets in Vacuum Sputtering

Introduction to Vacuum Sputtering

Vacuum sputtering is a thin-film technology to deposit thin films and coatings by creating a sub-atmospheric pressure environment and an atomic or molecular condensable vapor source. The basic principle is to make argon (Ar) ions hit the surface of the sputtering target through glow discharge in a vacuum, so that the target atoms overflow and deposit on the substrate to form a thin film.

Most general metal materials use DC sputtering, while non-conductive ceramic materials use RF sputtering. The new sputtering coating equipment uses powerful magnets to accelerate the ionization of argon gas around the target material in a spiral shape, thereby increasing the probability of collision between the target material and argon ions, thereby increasing the sputtering rate.

Characteristics of Sputtering Coating Process

(1) It has a wide range of applications, and can make metal, alloy or insulator materials into thin films.

(2) Under proper setting conditions, multi-component targets can be made into thin films with the same composition.

(3) A mixture or compound of the target substance and gas molecules can be produced by adding oxygen or another reactive gas to the discharge atmosphere.

(4) The target input current and sputtering time are controllable, which is conducive to obtaining high-precision film thickness.

(5) Sputtering coating is more conducive to producing large-area uniform films than other processes.

(6) The sputtered particles are not affected by gravity, and the positions of the target and the substrate can be freely arranged.

(7) The bonding strength between the substrate and the film is more than 10 times that of the general evaporated film, and because the sputtering particles have high energy, the surface of the film is continuously diffused to obtain a hard and dense film. At the same time, high energy allows the substrate to obtain a crystalline film at a lower temperature.

(8) The nucleation density is high at the initial stage of film formation, and an extremely thin continuous film of 10 nm or less can be produced.

(9) The target has a long service life and can be continuously produced for a long time.

(10) The target can be made into various shapes, and with the special design of the machine, it can be controlled better and has the highest efficiency.

How Target Purity Affects Thin Film Quality

Many factors can affect the quality of a thin film, of which the purity of the sputtering target has the greatest impact. If the target material is not pure enough, the impurity particles in the target material will adhere to the surface of the substrate during the sputtering process, causing the film layer in some positions to be weak and peel off. Simply put, the higher the purity of the target material, the better the performance of the film.

For targets with poor thermal conductivity, such as silicon aluminum sputtering targets, the heat transfer is often hindered by impurities in the target. There is a difference between the cooling water temperature used in production and the actual water temperature of the coating line, which leads to cracking of the target during use. Generally speaking, slight cracks will not have a great impact on coating production. However, when the target has obvious cracks, the charge is easily concentrated on the edge of the crack, resulting in abnormal discharge on the surface of the target. Discharging will lead to slag falling, abnormal film formation, and increased product scrapping. Therefore, in the process of target preparation and purity control, it is also necessary to control the preparation process conditions.

Stanford Advanced Materials (SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

Impact of Thin Film Technology on The Crystalline Silicon Industry

Judging from the current development of photovoltaic technology, thin films, especially CIGS thin films, will gradually become the mainstream of solar power generation.

Thin-Film Solar Cell

Thin-film photovoltaic cells, also known as solar cells, are devices that use the photovoltaic effect to convert light energy into electrical energy. They are considered novel photovoltaic devices that can alleviate the energy crisis.

Thin-film solar cells can be fabricated on substrates using materials such as ceramics, graphite, and metal sheets. These raw materials, while relatively cheap, work very well. They can make thin films with a thickness of only a few micrometers, and the current conversion efficiency can reach 13%.

In addition to planar, thin-film solar cells can also be made into non-planar structures because of their flexibility. Therefore, they have a wide range of applications and can be combined with or become part of buildings.

CIGS Film

The aforementioned CIGS is mainly composed of Cu (copper), In (indium), Ga (gallium), and Se (selenium), and the complete chemical formula is CuInxGa(1-x)Se2. This material has many advantages, including strong light absorption ability, good power generation stability, high conversion rate, long daytime power generation time, low production cost, short energy recovery cycle, etc.

Polycrystalline Silicon Solar Cells — Ogunshile, Emmanuel. (2017). An Investigation into the Use of Hybrid Solar Power and Cloud Service Solutions for 24/7 Computing. 743-754. 10.5220/0006380007430754.

CIGS VS. Silicon

Why thin film technology will beat traditional crystalline silicon products? Comparing the two, you will find the following results.

The absolute power generation of the thin film is higher, and the average power generation is about 8-10% higher than that of crystalline silicon (depending on the location and climate of the power station).
The decay rate of CIGS thin film power generation is controllable, which means that the occurrence of power generation decay can be controlled by adopting effective technical means. The practice has proved that during the operation of the CIGS thin-film station, the power generation does not decrease, but increases slightly.

For the comparison between CIGS thin film and Silicon materials, you can refer to this article Silicon Thin-Film VS. CIGS Thin-Film for Solar Panels.

Conclusion

Although the crystalline silicon industry has matured and the conversion efficiency of monocrystalline silicon has also been improved, technical shortcomings restrict the sustainable development of the crystalline silicon industry. What’s worse is that its industrial chain is long, the cost is difficult to control, and crystalline silicon products are not competitive. From this point of view, the development of thin film technology, especially CIGS thin film, will get better and better.

Stanford Advanced Materials (SAM) is a global sputtering target manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. We provide high-purity CIGS materials and we insure you will be satisfied with our products. Please visit our website https://www.sputtertargets.net/ for more information.

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